Mems Packaging

Author: Lee Yung-cheng
Publisher: World Scientific
ISBN: 9813229373
Format: PDF, ePub, Mobi
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MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices. This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability. Contents: Introduction to MEMS Packaging (Y C Lee, Ramesh Ramadoss and Nils Hoivik)Silex's TSV Technology: Overview of Processes and MEMS Applications (Tomas Bauer and Thorbjörn Ebefors)Vertical Interconnects for High-end MEMS (Maaike M Visser Taklo and Sigurd Moe)Using Wafer-Level Packaging to Improve Sensor Manufacturability and Cost (Paul Pickering, Collin Twanow and Dean Spicer)Nasiri Fabrication Process for Low-Cost Motion Sensors in the Consumer Market (Steven Nasiri, Ramesh Ramadoss and Sandra Winkler)PCB Based MEMS and Microfluidics (Ramesh Ramadoss, Antonio Luque and Carmen Aracil)Single Wafer Encapsulation of MEMS Resonators (Janna Rodriguez and Thomas Kenny)Heterogeneous Integration and Wafer-Level Packaging of MEMS (Masayoshi Esashi and Shuji Tanaka)Packaging of Membrane-Based Polymer Microfluidic Systems (Yu-Chuan Su)Wafer-Level Solder Bonding by Using Localized Induction Heating (Hsueh-An Yang, Chiung-Wen Lin and Weileun Fang)Localized Sealing Schemes for MEMS Packaging (Y T Cheng, Y C Su and Liwei Lin)Microsprings for High-Density Flip-Chip Packaging (Eugene M Chow and Christopher L Chua)MEMS Reliability (Chien-Ming Huang, Arvind Sai SarathiVasan, Yunhan Huang, Ravi Doraiswami, Michael Osterman and Michael Pecht) Readership: Researchers and graduate students participating in research, R&D, and manufacturing of MEMS products; professionals associated with the integration for systems represented by smartphones, AR/VR, and wearable electronics. Keywords: MEMS;Packaging;Microelectromechanical Systems;Reliability;Microstructures;Sensors;ActuatorsReview: Key Features: The book covers engineering topics critical to product development as well as research topics critical to integration for future MEMS-enabled systemsIt is a major resource for those participating in MEMS and for every professional associated with the integration for systems represented by smartphones, AR/VR and wearable electronics

Nonlinearity in Energy Harvesting Systems

Author: Elena Blokhina
Publisher: Springer
ISBN: 331920355X
Format: PDF, ePub, Docs
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This book is a single-source guide to nonlinearity and nonlinear techniques in energy harvesting, with a focus on vibration energy harvesters for micro and nanoscale applications. The authors demonstrate that whereas nonlinearity was avoided as an undesirable phenomenon in early energy harvesters, now it can be used as an essential part of these systems. Readers will benefit from an overview of nonlinear techniques and applications, as well as deeper insight into methods of analysis and modeling of energy harvesters, employing different nonlinearities. The role of nonlinearity due to different aspects of an energy harvester is discussed, including nonlinearity due to mechanical-to-electrical conversion, nonlinearity due to conditioning electronic circuits, nonlinearity due to novel materials (e.g., graphene), etc. Coverage includes tutorial introductions to MEMS and NEMS technology, as well as a wide range of applications, such as nonlinear oscillators and transducers for energy harvesters and electronic conditioning circuits for effective energy processing.

Simultaneous Localization and Mapping for Mobile Robots Introduction and Methods

Author: Fernández-Madrigal, Juan-Antonio
Publisher: IGI Global
ISBN: 1466621052
Format: PDF, ePub, Docs
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As mobile robots become more common in general knowledge and practices, as opposed to simply in research labs, there is an increased need for the introduction and methods to Simultaneous Localization and Mapping (SLAM) and its techniques and concepts related to robotics. Simultaneous Localization and Mapping for Mobile Robots: Introduction and Methods investigates the complexities of the theory of probabilistic localization and mapping of mobile robots as well as providing the most current and concrete developments. This reference source aims to be useful for practitioners, graduate and postgraduate students, and active researchers alike.

New Trends in Networking Computing E learning Systems Sciences and Engineering

Author: Khaled Elleithy
Publisher: Springer
ISBN: 3319067648
Format: PDF, ePub, Mobi
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This book includes a set of rigorously reviewed world-class manuscripts addressing and detailing state-of-the-art research projects in the areas of Computer Science, Informatics, and Systems Sciences, and Engineering. It includes selected papers form the conference proceedings of the Ninth International Joint Conferences on Computer, Information, and Systems Sciences, and Engineering (CISSE 2013). Coverage includes topics in: Industrial Electronics, Technology & Automation, Telecommunications and Networking, Systems, Computing Sciences and Software Engineering, Engineering Education, Instructional Technology, Assessment, and E-learning. • Provides the latest in a series of books growing out of the International Joint Conferences on Computer, Information, and Systems Sciences, and Engineering; • Includes chapters in the most advanced areas of Computing, Informatics, Systems Sciences, and Engineering; • Accessible to a wide range of readership, including professors, researchers, practitioners and students.

Fundamentals of Microfabrication

Author: Marc J. Madou
Publisher: CRC Press
ISBN: 9780849308260
Format: PDF, Docs
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MEMS technology and applications have grown at a tremendous pace, while structural dimensions have grown smaller and smaller, reaching down even to the molecular level. With this movement have come new types of applications and rapid advances in the technologies and techniques needed to fabricate the increasingly miniature devices that are literally changing our world. A bestseller in its first edition, Fundamentals of Microfabrication, Second Edition reflects the many developments in methods, materials, and applications that have emerged recently. Renowned author Marc Madou has added exercise sets to each chapter, thus answering the need for a textbook in this field. Fundamentals of Microfabrication, Second Edition offers unique, in-depth coverage of the science of miniaturization, its methods, and materials. From the fundamentals of lithography through bonding and packaging to quantum structures and molecular engineering, it provides the background, tools, and directions you need to confidently choose fabrication methods and materials for a particular miniaturization problem. New in the Second Edition Revised chapters that reflect the many recent advances in the field Updated and enhanced discussions of topics including DNA arrays, microfluidics, micromolding techniques, and nanotechnology In-depth coverage of bio-MEMs, RF-MEMs, high-temperature, and optical MEMs. Many more links to the Web Problem sets in each chapter

Manufacturing Engineering Handbook Second Edition

Author: Hwaiyu Geng
Publisher: McGraw Hill Professional
ISBN: 007183978X
Format: PDF, ePub, Docs
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The new edition of this professional resource reveals how to optimize all aspects of the global manufacturing process to build the highest quality goods at the lowest price in the shortest possible time. How can one apply technical and business knowledge to develop a strategic plan that delivers increased productivity, quality, sustainability, reliability, agility, resilience, and best practices with rapid time to production and value? The answers are found in the fully updated new edition of Manufacturing Engineering Handbook. The goal of this second edition is to provide the essential knowledge needed to build products with the highest quality at the lowest cost in the least amount of time by optimizing all aspects of the manufacturing process—design, development, tools, processes, quality, speed, output, safety, and sustainability. You will gain access to information on conventional and modern technologies, manufacturing processes, and operations management that will assist you in achieving these goals. The book is written by a team of more than 100 internationally renowned manufacturing engineering experts, and pared down from its original 1200 pages. The new and vastly improved second edition is specifically designed to concisely and succinctly cover traditional manufacturing processes and advanced technologies as well as newer manufacturing software and systems to integrate them into the modern, global manufacturing world. Brand-new chapters on: eco-design and sustainability; nano materials and nano manufacturing; facilities planning; operations research New sections on plastics, composites, and moldmaking; global manufacturing and supply chain management Increased coverage of Design for Six Sigma and adaptive manufacturing Affiliated web site with color illustrations, graphs, charts, discussions on future trends, additional technical papers, and suggestions for further reading

Sensors and Actuators

Author: Clarence W. de Silva
Publisher: CRC Press
ISBN: 1466506822
Format: PDF, ePub, Mobi
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An engineering system contains multiple components that interconnect to perform a specific task. Starting from basic fundamentals through to advanced applications, Sensors and Actuators: Engineering System Instrumentation, Second Edition thoroughly explains the inner workings of an engineering system. The text first provides introductory material—practical procedures and applications in the beginning—and then methodically integrates more advanced techniques, theory, and concepts throughout the book. Emphasizing sensors, transducers, and actuators, the author discusses important aspects of component matching and interconnection, interface between the connected components, signal modification, and signal conditioning/modification. He also addresses functions, physical principles, operation and interaction, and the proper selection and interfacing of these components for various engineering/control applications. This second edition provides a thorough revision of the first and includes new worked examples, new applications, and thoroughly updated as well as entirely new material. In addition, it provides increased coverage of sensor systems technologies and updated coverage of computer tools, including MATLAB®, Simulink, and LabView. What’s New in the Second Edition: A new chapter on estimation from measurements, which includes various practical procedures and applications of estimation through sensed data New material on microelectromechanical systems (MEMS) New material on multisensor data fusion New material on networked sensing and localization Many new problems and worked examples Chapter highlights and summary sheets, for easy reference and recollection Sensors and Actuators: Engineering System Instrumentation, Second Edition provides users from a variety of engineering backgrounds with a complete overview of engineering system components for instrumentation. It presents current techniques, advanced theory and concepts, and addresses relevant design issues, component selection, and practical applications.