Handbook of Thin Film Deposition Processes and Techniques

Author: Krishna Seshan
Publisher: William Andrew
ISBN: 0815517785
Format: PDF, ePub, Mobi
Download Now
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques. Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

Handbook of Thin Film Deposition

Author: Krishna Seshan
Publisher: William Andrew
ISBN: 1437778739
Format: PDF, ePub
Download Now
Resumen: The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

Handbook of Thin Film Technology

Author: Hartmut Frey
Publisher: Springer Science & Business Media
ISBN: 3642054307
Format: PDF, Docs
Download Now
“Handbook of Thin Film Technology” covers all aspects of coatings preparation, characterization and applications. Different deposition techniques based on vacuum and plasma processes are presented. Methods of surface and thin film analysis including coating thickness, structural, optical, electrical, mechanical and magnetic properties of films are detailed described. The several applications of thin coatings and a special chapter focusing on nanoparticle-based films can be found in this handbook. A complete reference for students and professionals interested in the science and technology of thin films.

Handbook of Deposition Technologies for Films and Coatings

Author: Peter M. Martin
Publisher: William Andrew
ISBN: 0815520328
Format: PDF, ePub, Mobi
Download Now
This 3e, edited by Peter M. Martin, PNNL 2005 Inventor of the Year, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. This long-awaited revision includes updated and new chapters on atomic layer deposition, cathodic arc deposition, sculpted thin films, polymer thin films and emerging technologies. Extensive material was added throughout the book, especially in the areas concerned with plasma-assisted vapor deposition processes and metallurgical coating applications. * Explains in depth the many recent i

Fiber Reinforced Ceramic Composites

Author: K.S. Mazdiyasni
Publisher: William Andrew
ISBN: 9780815512332
Format: PDF, ePub
Download Now
This book was the first comprehensive treatment of continuous and discontinuous ceramic fiber and whisker reinforced ceramic composites. Particular attention is given to the chemistry of sol-gel derived oxide and preceramic polymer derived nonoxide ceramic fibers and matrices, emphasizing their properties and characteristics. Theory, modeling and processing methodologies used for the research and development and manufacturing of advanced structural ceramic composites are included. The importance of the fiber matrix interface and long-term stability of the reinforcement fibers within a matrix are stressed. Opportunities and needs for ceramic composites as engineering materials are assessed as well.

Hybrid Microcircuit Technology Handbook 2nd Edition

Author: James J. Licari
Publisher: Elsevier
ISBN: 081551798X
Format: PDF, Mobi
Download Now
The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.

Hybrid Microcircuit Technology Handbook 2nd Edition

Author: James J. Licari
Publisher: William Andrew
ISBN: 9780080946597
Format: PDF, Mobi
Download Now
The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.

Thin Film Processes II

Author: Werner Kern
Publisher: Elsevier
ISBN: 0080524214
Format: PDF, ePub, Mobi
Download Now
This sequel to the 1978 classic, Thin Film Processes, gives a clear, practical exposition of important thin film deposition and etching processes that have not yet been adequately reviewed. It discusses selected processes in tutorial overviews with implementation guide lines and an introduction to the literature. Though edited to stand alone, when taken together, Thin Film Processes II and its predecessor present a thorough grounding in modern thin film techniques. Provides an all-new sequel to the 1978 classic, Thin Film Processes Introduces new topics, and several key topics presented in the original volume are updated Emphasizes practical applications of major thin film deposition and etching processes Helps readers find the appropriate technology for a particular application

Materials Science of Thin Films

Author: Milton Ohring
Publisher: Elsevier
ISBN: 0080491782
Format: PDF, ePub, Mobi
Download Now
This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.