Materials for Advanced Packaging

Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Format: PDF, ePub, Mobi
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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Advanced Materials for Thermal Management of Electronic Packaging

Author: Xingcun Colin Tong Ph.D
Publisher: Springer Science & Business Media
ISBN: 9781441977595
Format: PDF, Kindle
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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Advanced Flip Chip Packaging

Author: Tong Ho-Ming
Publisher: Springer Science & Business Media
ISBN: 1441957685
Format: PDF, Kindle
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Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Advanced Adhesives in Electronics

Author: M O Alam
Publisher: Elsevier
ISBN: 0857092898
Format: PDF, ePub
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Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Innovations in Food Packaging

Author: Jung H. Han
Publisher: Academic Press
ISBN: 0123948355
Format: PDF, ePub, Mobi
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This new edition of Innovations in Food Packaging ensures that readers have the most current information on food packaging options, including active packaging, intelligent packaging, edible/biodegradable packaging, nanocomposites and other options for package design. Today's packaging not only contains and protects food, but where possible and appropriate, it can assist in inventory control, consumer education, increased market availability and shelf life, and even in ensuring the safety of the food product. As nanotechnology and other technologies have developed, new and important options for maximizing the role of packaging have emerged. This book specifically examines the whole range of modern packaging options. It covers edible packaging based on carbohydrates, proteins, and lipids, antioxidative and antimicrobial packaging, and chemistry issues of food and food packaging, such as plasticization and polymer morphology. Professionals involved in food safety and shelf life, as well as researchers and students of food science, will find great value in this complete and updated overview. New to this edition: Over 60% updated content — including nine completely new chapters — with the latest developments in technology, processes and materials Now includes bioplastics, biopolymers, nanoparticles, and eco-design of packaging

Semiconductor Packaging

Author: Andrea Chen
Publisher: CRC Press
ISBN: 1439862079
Format: PDF, ePub
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In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing—package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability. By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.

Plastic Packaging Materials for Food

Author: Otto G. Piringer
Publisher: John Wiley & Sons
ISBN: 3527613293
Format: PDF, Kindle
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Plastics have developed into the most important class of packaging materials. Their relative impermeability for substances from the surroundings has great influence on the shelf life and the quality of the packed goods. At the same time the interaction between the contents and the various components of the packaging plays a decisive role. This particular book is indispensable in the search for the optimal plastic packaging. It facilitates the estimation of the influence on the goods which come from the surroundings and from the packaging. The authors do not restrict themselves only to the description of the phenomena of diffusion or transport in theory, but they show what they mean for practical applications. Food represents the central theme as main area of application for plastic packaging. It can be considered to be the "model substance" and the findings are to be applied to many other products and systems. The main rules and regulations for food packaging of the European Community and the United States are presented in this book. Furthermore the authors emphasize the testing methods for proving the mass transport and the sensory check of the quality of the products.

Materials for Information Technology

Author: Ehrenfried Zschech
Publisher: Springer Science & Business Media
ISBN: 1846282357
Format: PDF, ePub, Mobi
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This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.

Electronic Packaging Materials and Their Properties

Author: Michael Pecht
Publisher: CRC Press
ISBN: 135183004X
Format: PDF, ePub
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Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Materials for Electronic Packaging

Author: Deborah D.L. Chung
Publisher: Elsevier
ISBN: 9780080511177
Format: PDF
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Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems