On Chip Communication Architectures

Author: Sudeep Pasricha
Publisher: Morgan Kaufmann
ISBN: 9780080558288
Format: PDF, ePub
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Over the past decade, system-on-chip (SoC) designs have evolved to address the ever increasing complexity of applications, fueled by the era of digital convergence. Improvements in process technology have effectively shrunk board-level components so they can be integrated on a single chip. New on-chip communication architectures have been designed to support all inter-component communication in a SoC design. These communication architecture fabrics have a critical impact on the power consumption, performance, cost and design cycle time of modern SoC designs. As application complexity strains the communication backbone of SoC designs, academic and industrial R&D efforts and dollars are increasingly focused on communication architecture design. On-Chip Communication Architecures is a comprehensive reference on concepts, research and trends in on-chip communication architecture design. It will provide readers with a comprehensive survey, not available elsewhere, of all current standards for on-chip communication architectures. A definitive guide to on-chip communication architectures, explaining key concepts, surveying research efforts and predicting future trends Detailed analysis of all popular standards for on-chip communication architectures Comprehensive survey of all research on communication architectures, covering a wide range of topics relevant to this area, spanning the past several years, and up to date with the most current research efforts Future trends that with have a significant impact on research and design of communication architectures over the next several years

Networks on Chips

Author: Giovanni De Micheli
Publisher: Elsevier
ISBN: 9780080473567
Format: PDF
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The design of today's semiconductor chips for various applications, such as telecommunications, poses various challenges due to the complexity of these systems. These highly complex systems-on-chips demand new approaches to connect and manage the communication between on-chip processing and storage components and networks on chips (NoCs) provide a powerful solution. This book is the first to provide a unified overview of NoC technology. It includes in-depth analysis of all the on-chip communication challenges, from physical wiring implementation up to software architecture, and a complete classification of their various Network-on-Chip approaches and solutions. * Leading-edge research from world-renowned experts in academia and industry with state-of-the-art technology implementations/trends * An integrated presentation not currently available in any other book * A thorough introduction to current design methodologies and chips designed with NoCs

Communication Architectures for Systems on Chip

Author: José L. Ayala
Publisher: CRC Press
ISBN: 1439841713
Format: PDF, ePub, Docs
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A presentation of state-of-the-art approaches from an industrial applications perspective, Communication Architectures for Systems-on-Chip shows professionals, researchers, and students how to attack the problem of data communication in the manufacture of SoC architectures. With its lucid illustration of current trends and research improving the performance, quality, and reliability of transactions, this is an essential reference for anyone dealing with communication mechanisms for embedded systems, systems-on-chip, and multiprocessor architectures—or trying to overcome existing limitations. Exploring architectures currently implemented in manufactured SoCs—and those being proposed—this book analyzes a wide range of applications, including: Well-established communication buses Less common networks-on-chip Modern technologies that include the use of carbon nanotubes (CNTs) Optical links used to speed up data transfer and boost both security and quality of service (QoS) The book’s contributors pay special attention to newer problems, including how to protect transactions of critical on-chip information (personal data, security keys, etc.) from an external attack. They examine mechanisms, revise communication protocols involved, and analyze overall impact on system performance.

Computer System Design

Author: Michael J. Flynn
Publisher: John Wiley & Sons
ISBN: 9781118009918
Format: PDF, ePub, Docs
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The next generation of computer system designers will be less concerned about details of processors and memories, and more concerned about the elements of a system tailored to particular applications. These designers will have a fundamental knowledge of processors and other elements in the system, but the success of their design will depend on the skills in making system-level tradeoffs that optimize the cost, performance and other attributes to meet application requirements. This book provides a new treatment of computer system design, particularly for System-on-Chip (SOC), which addresses the issues mentioned above. It begins with a global introduction, from the high-level view to the lowest common denominator (the chip itself), then moves on to the three main building blocks of an SOC (processor, memory, and interconnect). Next is an overview of what makes SOC unique (its customization ability and the applications that drive it). The final chapter presents future challenges for system design and SOC possibilities.

Designing SOCs with Configured Cores

Author: Steve Leibson
Publisher: Elsevier
ISBN: 9780080472454
Format: PDF, Mobi
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Microprocessor cores used for SOC design are the direct descendents of Intel’s original 4004 microprocessor. Just as packaged microprocessor ICs vary widely in their attributes, so do microprocessors packaged as IP cores. However, SOC designers still compare and select processor cores the way they previously compared and selected packaged microprocessor ICs. The big problem with this selection method is that it assumes that the laws of the microprocessor universe have remained unchanged for decades. This assumption is no longer valid. Processor cores for SOC designs can be far more plastic than microprocessor ICs for board-level system designs. Shaping these cores for specific applications produces much better processor efficiency and much lower system clock rates. Together, Tensilica’s Xtensa and Diamond processor cores constitute a family of software-compatible microprocessors covering an extremely wide performance range from simple control processors, to DSPs, to 3-way superscalar processors. Yet all of these processors use the same software-development tools so that programmers familiar with one processor in the family can easily switch to another. This book emphasizes a processor-centric MPSOC (multiple-processor SOC) design style shaped by the realities of the 21st-century and nanometer silicon. It advocates the assignment of tasks to firmware-controlled processors whenever possible to maximize SOC flexibility, cut power dissipation, reduce the size and number of hand-built logic blocks, shrink the associated verification effort, and minimize the overall design risk. · An essential, no-nonsense guide to the design of 21st-century mega-gate SOCs using nanometer silicon. · Discusses today's key issues affecting SOC design, based on author's decades of personal experience in developing large digital systems as a design engineer while working at Hewlett-Packard's Desktop Computer Division and at EDA workstation pioneer Cadnetix, and covering such topics as an award-winning technology journalist and editor-in-chief for EDN magazine and the Microprocessor Report. · Explores conventionally accepted boundaries and perceived limits of processor-based system design and then explodes these artificial constraints through a fresh outlook on and discussion of the special abilities of processor cores designed specifically for SOC design. · Thorough exploration of the evolution of processors and processor cores used for ASIC and SOC design with a look at where the industry has come from, and where it's going. · Easy-to-understand explanations of the capabilities of configurable and extensible processor cores through a detailed examination of Tensilica's configurable, extensible Xtensa processor core and six pre-configured Diamond cores. · The most comprehensive assessment available of the practical aspects of configuring and using multiple processor cores to achieve very difficult and ambitious SOC price, performance, and power design goals.

System on Chip Test Architectures

Author: Laung-Terng Wang
Publisher: Morgan Kaufmann
ISBN: 9780080556802
Format: PDF, ePub, Mobi
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Modern electronics testing has a legacy of more than 40 years. The introduction of new technologies, especially nanometer technologies with 90nm or smaller geometry, has allowed the semiconductor industry to keep pace with the increased performance-capacity demands from consumers. As a result, semiconductor test costs have been growing steadily and typically amount to 40% of today's overall product cost. This book is a comprehensive guide to new VLSI Testing and Design-for-Testability techniques that will allow students, researchers, DFT practitioners, and VLSI designers to master quickly System-on-Chip Test architectures, for test debug and diagnosis of digital, memory, and analog/mixed-signal designs. Emphasizes VLSI Test principles and Design for Testability architectures, with numerous illustrations/examples. Most up-to-date coverage available, including Fault Tolerance, Low-Power Testing, Defect and Error Tolerance, Network-on-Chip (NOC) Testing, Software-Based Self-Testing, FPGA Testing, MEMS Testing, and System-In-Package (SIP) Testing, which are not yet available in any testing book. Covers the entire spectrum of VLSI testing and DFT architectures, from digital and analog, to memory circuits, and fault diagnosis and self-repair from digital to memory circuits. Discusses future nanotechnology test trends and challenges facing the nanometer design era; promising nanotechnology test techniques, including Quantum-Dots, Cellular Automata, Carbon-Nanotubes, and Hybrid Semiconductor/Nanowire/Molecular Computing. Practical problems at the end of each chapter for students.

Encyclopedia of Information Science and Technology Third Edition

Author: Khosrow-Pour, Mehdi
Publisher: IGI Global
ISBN: 1466658894
Format: PDF, Docs
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"This 10-volume compilation of authoritative, research-based articles contributed by thousands of researchers and experts from all over the world emphasized modern issues and the presentation of potential opportunities, prospective solutions, and future directions in the field of information science and technology"--Provided by publisher.

Designing 2D and 3D Network on Chip Architectures

Author: Konstantinos Tatas
Publisher: Springer Science & Business Media
ISBN: 1461442745
Format: PDF, Docs
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This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.

Three Dimensional Integrated Circuit Design

Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Format: PDF, ePub
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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization