Rapid Thermal Processing

Author: Richard B. Fair
Publisher: Academic Press
ISBN: 0323139809
Format: PDF, Kindle
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This is the first definitive book on rapid thermal processing (RTP), an essential namufacturing technology for single-wafer processing in highly controlled environments. Written and edited by nine experts in the field, this book covers a range of topics for academics and engineers alike, moving from basic theory to advanced technology for wafer manufacturing. The book also provides new information on the suitability or RTP for thin film deposition, junction formation, silicides, epitaxy, and in situ processing. Complete discussions on equipment designs and comparisons between RTP and other processing approaches also make this book useful for supplemental information on silicon processing, VLSI processing, and integrated circuit engineering.

Rapid Thermal and Integrated Processing IV

Author: J. C. Gelpty
Publisher: Materials Research Society
ISBN: 9781558993747
Format: PDF, Docs
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The MRS proceedings series on rapid thermal processing (RTP) has become the predominant international forum for research in this exciting and fast-growing field. In particular, this book in the series clearly indicates that the science of RTP is increasingly better understood and that equipment simulation and engineering have matured. With the so-called 'second generation' equipment vendors are providing useful and production-worthy solutions to the most pertinent problems within RTP - temperature measurement and reproducability. For that reason, the issues of temperature calibration and metrology, along with the International Temperature Scale, are featured. The evaluation and modelling of furnace, mini-bath and single-wafer RTP furnaces as the thermal method of choice are also addressed. Interesting developments are reported in the processing of dielectrics. Applications outside the field of silicon semiconductors are also presented. Topics include: measurement; RTCVD; modelling and manufacturing; integrated processing; silicides; annealing and defects; dielectrics; and RTP of III-V materials and other novel applications.

Rapid Thermal and Other Short time Processing Technologies

Author: Fred Roozeboom
Publisher: The Electrochemical Society
ISBN: 9781566772747
Format: PDF, ePub, Mobi
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The proceedings from this May 2000 symposium illustrate the range of applications in Rapid Thermal Processing (RTP). The refereed papers cover a variety of issues, such as ultra-shallow junctions; contacts for nanoscale CMOS; gate stacks; new applications of RTP, such as for the enhanced crystalization of amorphous silicon thin films; and advances on RTP systems and process monitoring, including optimizing and controlling gas flows in an RTCVD reactor. Most presentations are supported by charts and other graphical data. c. Book News Inc.

Advances in Rapid Thermal and Integrated Processing

Author: F. Roozeboom
Publisher: Springer Science & Business Media
ISBN: 9401587116
Format: PDF, ePub
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Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.

Rapid Thermal Processing for Future Semiconductor Devices

Author: H. Fukuda
Publisher: Elsevier
ISBN: 9780080540269
Format: PDF, ePub
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This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices. This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.

Rapid Thermal Processing of Semiconductors

Author: Victor E. Borisenko
Publisher: Springer Science & Business Media
ISBN: 1489918043
Format: PDF, ePub
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Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.

Transient Thermal Processing Techniques in Electronic Materials

Author: Nuggehalli M. Ravindra
Publisher: Tms
ISBN:
Format: PDF, Kindle
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This volume presents a research update of silicon and non-silicon transient processing techniques such as rapid thermal processing, pulsed laser processes, flash evaporation, jet processes, and more. Also covered are process sensors, equipment issues, and the manufacturing perspective.