SMT Soldering Handbook

Author: RUDOLF STRAUSS
Publisher: Elsevier
ISBN: 9780080480978
Format: PDF, ePub, Docs
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Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. Written by founding father of SMT technology Standard specifications have been fully updated New chapter covering Ball Grid Array (BGA) technology

Soldering Handbook For Printed Circuits and Surface Mounting

Author: Howard H. Manko
Publisher: Springer Science & Business Media
ISBN: 9780442012069
Format: PDF, Docs
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Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.

The Handbook of Machine Soldering

Author: Ralph W. Woodgate
Publisher: Wiley
ISBN: 9780471139041
Format: PDF, ePub, Mobi
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A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment--and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control methods for solder, fluxes, and solder paste * Defines standards of quality and shows how they can be achieved and maintained Widely accepted in industrial and military circles, The Handbook of Machine Soldering is an important resource for production managers, engineers, supervisors, operators, and anyone involved day-to-day in electronic manufacturing. It is a proven text for upper-level undergraduate college courses and for soldering seminars geared toward apprentices and future managers.

Electronic Materials Handbook

Author:
Publisher: ASM International
ISBN: 9780871702852
Format: PDF, ePub
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Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

The Electronics Handbook

Author: Jerry C. Whitaker
Publisher: CRC Press
ISBN: 9780849383458
Format: PDF
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The superb organization of The Electronics Handbook means that it is not only a comprehensive and fascinating reference, but also a pleasure to use. Some of these organizational features include:

Handbook of Lead Free Solder Technology for Microelectronic Assemblies

Author: Karl J. Puttlitz
Publisher: CRC Press
ISBN: 082475249X
Format: PDF, ePub
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This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Manufacturing

Author: Beno Benhabib
Publisher: CRC Press
ISBN: 0824756207
Format: PDF, Docs
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From concept development to final production, this comprehensive text thoroughly examines the design, prototyping, and fabrication of engineering products and emphasizes modern developments in system modeling, analysis, and automatic control. This reference details various management strategies, design methodologies, traditional production techniques, and assembly applications for clear illustration of manufacturing engineering technology in the modern age. Considers a variety of methods for product design including axiomatic design, design for X, group technology, and the Taguchi method, as well as modern production techniques including laser-beam machining, microlithography.