Solder Joint Reliability Assessment

Author: Mohd N. Tamin
Publisher: Springer Science & Business
ISBN: 3319000926
Format: PDF, Mobi
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This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.

Solder Joint Reliability Prediction for Multiple Environments

Author: Andrew E. Perkins
Publisher: Springer Science & Business Media
ISBN: 0387793941
Format: PDF, ePub, Mobi
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Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Handbook of Research on Advanced Computational Techniques for Simulation Based Engineering

Author: Samui, Pijush
Publisher: IGI Global
ISBN: 1466694807
Format: PDF, Mobi
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Recent developments in information processing systems have driven the advancement of computational methods in the engineering realm. New models and simulations enable better solutions for problem-solving and overall process improvement. The Handbook of Research on Advanced Computational Techniques for Simulation-Based Engineering is an authoritative reference work representing the latest scholarly research on the application of computational models to improve the quality of engineering design. Featuring extensive coverage on a range of topics from various engineering disciplines, including, but not limited to, soft computing methods, comparative studies, and hybrid approaches, this book is a comprehensive reference source for students, professional engineers, and researchers interested in the application of computational methods for engineering design.

Design Reliability of Solders and Solder Interconnections

Author: Rao K. Mahidhara
Publisher: Tms
Format: PDF, ePub, Docs
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The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliability such as microstructural stability in service, creep, fatigue, creep/fatigue interactions, and thermomechanical fatigue of bulk solders and solder joints.