Solder Joint Reliability Assessment

Author: Mohd N. Tamin
Publisher: Springer Science & Business
ISBN: 3319000926
Format: PDF, Kindle
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This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.

Solder Joint Technology

Author: King-Ning Tu
Publisher: Springer Science & Business Media
ISBN: 0387388923
Format: PDF, Docs
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The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.

Solder Joint Reliability Prediction for Multiple Environments

Author: Andrew E. Perkins
Publisher: Springer Science & Business Media
ISBN: 0387793941
Format: PDF, ePub, Docs
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Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Handbook of Research on Advanced Computational Techniques for Simulation Based Engineering

Author: Samui, Pijush
Publisher: IGI Global
ISBN: 1466694807
Format: PDF, Mobi
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Recent developments in information processing systems have driven the advancement of computational methods in the engineering realm. New models and simulations enable better solutions for problem-solving and overall process improvement. The Handbook of Research on Advanced Computational Techniques for Simulation-Based Engineering is an authoritative reference work representing the latest scholarly research on the application of computational models to improve the quality of engineering design. Featuring extensive coverage on a range of topics from various engineering disciplines, including, but not limited to, soft computing methods, comparative studies, and hybrid approaches, this book is a comprehensive reference source for students, professional engineers, and researchers interested in the application of computational methods for engineering design.

Issues in Structural and Materials Engineering 2011 Edition

Publisher: ScholarlyEditions
ISBN: 1464963967
Format: PDF, ePub, Mobi
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Issues in Structural and Materials Engineering: 2011 Edition is a ScholarlyEditions™ eBook that delivers timely, authoritative, and comprehensive information about Structural and Materials Engineering. The editors have built Issues in Structural and Materials Engineering: 2011 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Structural and Materials Engineering in this eBook to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Issues in Structural and Materials Engineering: 2011 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at

Benefiting from Thermal and Mechanical Simulation in Micro Electronics

Author: L.J. Ernst
Publisher: Springer Science & Business Media
ISBN: 9780792372783
Format: PDF, ePub, Docs
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"Benefiting from Thermal and Mechanical Simulation inMicro-Electronics" presents papers from the first internationalconference on this topic, EuroSimE2000. For the first time, peoplefrom the electronics industry, research institutes, software companiesand universities joined together to discuss present and possiblefuture thermal and mechanical related problems and challenges inmicro-electronics; the state-of-the-art methodologies for thermal &mechanical simulation and optimization of micro-electronics; and theperspectives of future simulation and optimization methodologydevelopment.Main areas covered are: - "Benefiting from Thermal and""Mechanical Simulation in Micro-Electronics" is suitable forstudents at graduate level and beyond, and for researchers, designersand specialists in the fields of microelectronics and mechanics.