System on Package

Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071593322
Format: PDF, Mobi
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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

Introduction to System on package SOP

Author:
Publisher:
ISBN: 9780071603157
Format: PDF, ePub, Mobi
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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where systems8221; used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat gener.

Wafer Level Chip Scale Packaging

Author: Shichun Qu
Publisher: Springer
ISBN: 1493915568
Format: PDF, ePub, Mobi
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Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

Future Trends in Microelectronics

Author: Serge Luryi
Publisher: John Wiley & Sons
ISBN: 1119069173
Format: PDF, ePub
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Presents the developments in microelectronic-related fields, with comprehensive insight from a number of leading industry professionals The book presents the future developments and innovations in the developing field of microelectronics. The book’s chapters contain contributions from various authors, all of whom are leading industry professionals affiliated either with top universities, major semiconductor companies, or government laboratories, discussing the evolution of their profession. A wide range of microelectronic-related fields are examined, including solid-state electronics, material science, optoelectronics, bioelectronics, and renewable energies. The topics covered range from fundamental physical principles, materials and device technologies, and major new market opportunities. Describes the expansion of the field into hot topics such as energy (photovoltaics) and medicine (bio-nanotechnology) Provides contributions from leading industry professionals in semiconductor micro- and nano-electronics Discusses the importance of micro- and nano-electronics in today’s rapidly changing and expanding information society Future Trends in Microelectronics: Journey into the Unknown is written for industry professionals and graduate students in engineering, physics, and nanotechnology.

Material Integrated Intelligent Systems

Author: Stefan Bosse
Publisher: John Wiley & Sons
ISBN: 3527679251
Format: PDF, Mobi
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Combining different perspectives from materials science, engineering, and computer science, this reference provides a unified view of the various aspects necessary for the successful realization of intelligent systems. The editors and authors are from academia and research institutions with close ties to industry, and are thus able to offer first-hand information here. They adopt a unique, three-tiered approach such that readers can gain basic, intermediate, and advanced topical knowledge. The technology section of the book is divided into chapters covering the basics of sensor integration in materials, the challenges associated with this approach, data processing, evaluation, and validation, as well as methods for achieving an autonomous energy supply. The applications part then goes on to showcase typical scenarios where material-integrated intelligent systems are already in use, such as for structural health monitoring and smart textiles.

Frontiers of Computing Systems Research

Author: Stuart K. Tewksbury
Publisher: Springer Science & Business Media
ISBN: 1461570328
Format: PDF
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Intended for an interdisciplinary audience involved in computer systems research, this second volume presents technical information on emerging topics in the field.

BioMEMS and Biomedical Nanotechnology

Author: Rashid Bashir
Publisher: Springer Science & Business Media
ISBN: 0387258450
Format: PDF, Mobi
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Offers a review of key aspects of BioMEMS sensors, including BioMEMS sensors and materials, means of manipulating biological entities at the microscale, and micro-fluidics and characterization.

Smart Electronic Systems

Author: Li-Rong Zheng
Publisher: Wiley-VCH
ISBN: 3527338950
Format: PDF, Docs
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Unique in focusing on both organic and inorganic materials from a system point of view, this text offers a complete overview of printed electronics integrated with classical silicon electronics. Following an introduction to the topic, the book discusses the materials and processes required for printed electronics, covering conducting, semiconducting and insulating materials, as well as various substrates, such as paper and plastics. Subsequent chapters describe the various building blocks for printed electronics, while the final part describes the resulting novel applications and technologies, including wearable electronics, RFID tags and flexible circuit boards. Suitable for a broad target group, both industrial and academic, ranging from mechanical engineers to ink developers, and from chemists to engineers.

Micro Total Analysis Systems 2004

Author: Thomas Laurell
Publisher: Royal Society of Chemistry
ISBN: 9780854048960
Format: PDF, Mobi
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The Eighth International Conference on Miniaturized Systems in Chemistry and Life Science - B5Tas 2004 - is an annual meeting focusing on the research, development and application of miniaturized technologies and methodologies in chemistry and life science. The conference is celebrating its tenth anniversary after the first workshop at the University of Twente, The Netherlands in 1994. This research field is rapidly developing and changing towards a domain where core competence areas such as microfluidics, micro- and nanotechnology, materials science, chemistry, biology, and medicine are melting together to a truly interdisciplinary meeting place. This volume is the second in a two volume set, a valuable reference collection to all working in this field.