Transmission Lines in Digital and Analog Electronic Systems

Author: Clayton R. Paul
Publisher: John Wiley & Sons
ISBN: 1118058240
Format: PDF, ePub
Download Now
In the last 30 years there have been dramatic changes in electrical technology--yet the length of the undergraduate curriculum has remained four years. Until some ten years ago, the analysis of transmission lines was a standard topic in the EE and CpE undergraduate curricula. Today most of the undergraduate curricula contain a rather brief study of the analysis of transmission lines in a one-semester junior-level course on electromagnetics. In some schools, this study of transmission lines is relegated to a senior technical elective or has disappeared from the curriculum altogether. This raises a serious problem in the preparation of EE and CpE undergraduates to be competent in the modern industrial world. For the reasons mentioned above, today's undergraduates lack the basic skills to design high-speed digital and high-frequency analog systems. It does little good to write sophisticated software if the hardware is unable to process the instructions. This problem will increase as the speeds and frequencies of these systems continue to increase seemingly without bound. This book is meant to repair that basic deficiency.

Understanding Signal Integrity

Author: Stephen C. Thierauf
Publisher: Artech House
ISBN: 1596939826
Format: PDF, ePub, Mobi
Download Now
This unique book provides you with practical guidance on understanding and interpreting signal integrity (SI) performance to help you with your challenging circuit board design projects. You find high-level discussions of important SI concepts presented in a clear and easily accessible format, including question and answer sections and bulleted lists.This valuable resource features rules of thumb and simple equations to help you make estimates of critical signal integrity parameters without using circuit simulators of CAD (computer-aided design). The book is supported with over 120 illustrations, nearly 100 equations, and detailed reference lists at the end of each chapter.

Transmission Lines in Digital Systems for EMC Practitioners

Author: Clayton R. Paul
Publisher: John Wiley & Sons
ISBN: 111814399X
Format: PDF, ePub
Download Now
This is a brief but comprehensive book covering the set of EMC skills that EMC practitioners today require in order to be successful in high-speed, digital electronics. The basic skills in the book are new and weren’t studied in most curricula some ten years ago. The rapidly changing digital technology has created this demand for a discussion of new analysis skills particularly for the analysis of transmission lines where the conductors that interconnect the electronic modules have become “electrically large,” longer than a tenth of a wavelength, which are increasingly becoming important. Crosstalk between the lines is also rapidly becoming a significant problem in getting modern electronic systems to work satisfactorily. Hence this text concentrates on the modeling of “electrically large” connection conductors where previously-used Kirchhoff’s voltage and current laws and lumped-circuit modeling have become obsolete because of the increasing speeds of modern digital systems. This has caused an increased emphasis on Signal Integrity. Until as recently as some ten years ago, digital system clock speeds and data rates were in the hundreds of megahertz (MHz) range. Prior to that time, the “lands” on printed circuit boards (PCBs) that interconnect the electronic modules had little or no impact on the proper functioning of those electronic circuits. Today, the clock and data speeds have moved into the low gigahertz (GHz) range.

Proceedings of Fifth International Conference on Soft Computing for Problem Solving

Author: Millie Pant
Publisher: Springer
ISBN: 981100448X
Format: PDF, Kindle
Download Now
The proceedings of SocProS 2015 will serve as an academic bonanza for scientists and researchers working in the field of Soft Computing. This book contains theoretical as well as practical aspects using fuzzy logic, neural networks, evolutionary algorithms, swarm intelligence algorithms, etc., with many applications under the umbrella of ‘Soft Computing’. The book will be beneficial for young as well as experienced researchers dealing across complex and intricate real world problems for which finding a solution by traditional methods is a difficult task. The different application areas covered in the proceedings are: Image Processing, Cryptanalysis, Industrial Optimization, Supply Chain Management, Newly Proposed Nature Inspired Algorithms, Signal Processing, Problems related to Medical and Health Care, Networking Optimization Problems, etc.

Digital Signal Integrity

Author: Brian Young
Publisher: Prentice Hall
ISBN: 9780130289049
Format: PDF, ePub
Download Now
Preface Effects of interconnects on the electrical performance of digital components, such as microprocessors, have historically been small enough to handle with simple rules of thumb. As clock rates, bus widths, and bus speeds have increased, packaging and interconnects have more importance and in some cases actually limit or define the system, where silicon performance is usually found to be the gating factor. This role reversal will become more common, and it may be that packaging and interconnects dominate electrical considerations at some point in the future as networks become more prominent. The relatively recent growth of packaging and interconnects as significant issues in electrical performance means that relatively few resources exist for learning and training. Much of it exists as scattered applications notes, many of which are quite useful but are sometimes somewhat dated (i.e., notes on ECL rather than CMOS) or are from the less accessible technical literature. Since many organizations are newly finding the need for expertise in the field, in-house experts may not be available to act as mentors. This book represents my efforts at collecting and deriving the necessary material to support a career in digital signal integrity modeling and simulation. A huge part of such a job is package and interconnect modeling from electromagnetic simulation and/or measurements. By necessity, the book spans a broad spectrum of techniques, including electromagnetic simulation, transmission line theory, frequency-domain modeling, time-domain modeling, analog circuit simulation, digital signaling, and some architectural issues, to put it all in perspective. Such a broad technological reach makes for a very interesting and challenging job. Since I believe that the number of engineers working this area will need to increase dramatically to support the technological trends, I hope that this book will provide a sufficient set of tools to help engineers succeed in this field. The goal of the book is to provide detailed introductory material that is self-consistent and self-contained. As such, there are very few references. There is nothing in the book that is new to the field, so technical credit must go to the innumerable contributors to the technical literature, application notes, and standards. The book is organized to move gradually from broad, general topics to specific modeling techniques. Particular emphasis is placed on rigorous derivation and on multiconductor interconnects. Chapter discusses the role of signal integrity in digital systems. Chapters and then cover issues in signaling and signal integrity. Chapters through cover detailed concepts in basic passive circuit components, with particular emphasis on multiconductor interconnects. One of the more difficult aspects of detailed simulations in signal integrity is the need to model multiconductor interconnects such as sockets, packages, edge connectors, and buses. Experimental characterization of interconnects is covered in chapter, where emphasis is on measurements of very small parasitics for high leadcount interconnects. Interconnect modeling is covered in chapters and, where distinction is drawn between low-frequency lumped modeling and high-frequency wideband modeling. Because interconnects are often physically small, lumped modeling is often the optimal choice. Finally, chapter provides extended coverage of signal integrity topics and represents advanced application of material and concepts from prior chapters. The manuscript was typeset using running under Linux on a PC clone based on a Tyan motherboard with a Cyrix processor. The text was prepared using a custom text editor written in Tcl/Tk. Circuit simulations used Berkeley SPICE 3f4. The figures were prepared using Xfig. Symbolic manipulation usedMathematica. Brian Young Austin, Texas

Signal Integrity

Author: Eric Bogatin
Publisher: Prentice Hall Professional
ISBN: 9780130669469
Format: PDF
Download Now
This thorough review of the fundamental principles associated with signal integrity provides engineering principles behind signal integrity effects, and applies this understanding to solving problems.

Signal and Power Integrity in Digital Systems

Author:
Publisher: McGraw-Hill Companies
ISBN: 9780070087347
Format: PDF, Kindle
Download Now
"This book shows designers how to ensure signal integrity and control noise in high-speed digital systems - particularly important in a Pentium-paced environment where functional logic design is no longer separable from electrical and mechanical design." "Highlighting TTL, CMOS, and BiCMOS logic applications in a single source, Signal and Power Integrity in Digital Systems provides a practical solutions-oriented approach to a wide variety of relevant interconnection and timing issues." "Special features include noise tolerant logic architectures; power distribution techniques that reduce noise; clock distribution techniques that ensure clock signal quality; signal interconnection techniques that reduce crosstalk, signal loading, and transmission-line effects; how to get optimum performance from high-speed memory devices; and system application tips for high-speed PALs, PLAs, FIFOs, and ASICs." "Designers will also appreciate the practical engineering approximations provided for the calculation of design parameters along with illustrations and numerous tables usable for quick reference and comparison of characteristics." "It's a book every digital designer should have - engineers involved in the design of computers, peripherals, signal processors, and control and communications equipment, as well as young engineers facing their first designs using high-speed logic devices."--BOOK JACKET.Title Summary field provided by Blackwell North America, Inc. All Rights Reserved

MECHANICAL SCIENCES

Author: AKSHAY RANJAN PAUL
Publisher: PHI Learning Pvt. Ltd.
ISBN: 9788120326118
Format: PDF, Docs
Download Now
Primarily intended for undergraduate students of all engineering disciplines, this comprehensive and up-to-date text strives to meet the long-felt need for a single book that covers Engineering Mechanics as well as Strength of Materials. The text is organized in three parts. Parts I and II provide an easily understandable presentation of the theory along with systematic application of the principles of statics and dynamics to engineering problems. Part III covers the basic topics in strength of materials in a clear, simple, direct fashion that uses an abundance of examples to clarify principles.

Signal Integrity and Radiated Emission of High Speed Digital Systems

Author: Spartaco Caniggia
Publisher: Wiley
ISBN: 9780470511664
Format: PDF
Download Now
Before putting digital systems for information technology or telecommunication applications on the market, an essential requirement is to perform tests in order to comply with the limits of radiated emission imposed by the standards. This book provides an investigation into signal integrity (SI) and electromagnetic interference (EMI) problems. Topics such as reflections, crosstalk, switching noise and radiated emission (RE) in high-speed digital systems are covered, which are essential for IT and telecoms applications. The highly important topic of modelling is covered which can reduce costs by enabling simulation data to demonstrate that a product meets design specifications and regulatory limits. According to the new European EMC directive, this can help to avoid the expensive use of large semi-anechoic chambers or open area test sites for radiated emission assessments. Following a short introduction to signalling and radiated interference in digital systems, the book provides a detailed characterization of logic families in terms of static and dynamic characteristic useful for modelling techniques. Crosstalk in multi-coupled line structures are investigated by analytical, graphical and circuit-based methods, and techniques to mitigate these phenomena are provided. Grounding, filtering and shielding with multilayer PCBs are also examined and design rules given. Written by authors with extensive experience in industry and academia. Explains basic conceptual problems from a theoretical and practical point of view by using numerous measurements and simulations. Presents models for mathematical and SPICE-like circuit simulators. Provides examples of using full-wave codes for SI and RE investigations. Companion website containing lists of codes and sample material. Signal Integrity and Radiated Emission of High-Speed Digital Systems is a valuable resource to industrial designers of information technology, telecommunication equipment and automation equipment as well as to development engineers. It will also be of interest to managers and designers of consumer electronics, and researchers in electronics.