Transmission Lines in Digital and Analog Electronic Systems

Author: Clayton R. Paul
Publisher: John Wiley & Sons
ISBN: 1118058240
Format: PDF, ePub, Mobi
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In the last 30 years there have been dramatic changes in electrical technology--yet the length of the undergraduate curriculum has remained four years. Until some ten years ago, the analysis of transmission lines was a standard topic in the EE and CpE undergraduate curricula. Today most of the undergraduate curricula contain a rather brief study of the analysis of transmission lines in a one-semester junior-level course on electromagnetics. In some schools, this study of transmission lines is relegated to a senior technical elective or has disappeared from the curriculum altogether. This raises a serious problem in the preparation of EE and CpE undergraduates to be competent in the modern industrial world. For the reasons mentioned above, today's undergraduates lack the basic skills to design high-speed digital and high-frequency analog systems. It does little good to write sophisticated software if the hardware is unable to process the instructions. This problem will increase as the speeds and frequencies of these systems continue to increase seemingly without bound. This book is meant to repair that basic deficiency.

Digital Signal Integrity

Author: Brian Young
Publisher: Prentice Hall
ISBN: 9780130289049
Format: PDF, ePub, Docs
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Preface Effects of interconnects on the electrical performance of digital components, such as microprocessors, have historically been small enough to handle with simple rules of thumb. As clock rates, bus widths, and bus speeds have increased, packaging and interconnects have more importance and in some cases actually limit or define the system, where silicon performance is usually found to be the gating factor. This role reversal will become more common, and it may be that packaging and interconnects dominate electrical considerations at some point in the future as networks become more prominent. The relatively recent growth of packaging and interconnects as significant issues in electrical performance means that relatively few resources exist for learning and training. Much of it exists as scattered applications notes, many of which are quite useful but are sometimes somewhat dated (i.e., notes on ECL rather than CMOS) or are from the less accessible technical literature. Since many organizations are newly finding the need for expertise in the field, in-house experts may not be available to act as mentors. This book represents my efforts at collecting and deriving the necessary material to support a career in digital signal integrity modeling and simulation. A huge part of such a job is package and interconnect modeling from electromagnetic simulation and/or measurements. By necessity, the book spans a broad spectrum of techniques, including electromagnetic simulation, transmission line theory, frequency-domain modeling, time-domain modeling, analog circuit simulation, digital signaling, and some architectural issues, to put it all in perspective. Such a broad technological reach makes for a very interesting and challenging job. Since I believe that the number of engineers working this area will need to increase dramatically to support the technological trends, I hope that this book will provide a sufficient set of tools to help engineers succeed in this field. The goal of the book is to provide detailed introductory material that is self-consistent and self-contained. As such, there are very few references. There is nothing in the book that is new to the field, so technical credit must go to the innumerable contributors to the technical literature, application notes, and standards. The book is organized to move gradually from broad, general topics to specific modeling techniques. Particular emphasis is placed on rigorous derivation and on multiconductor interconnects. Chapter discusses the role of signal integrity in digital systems. Chapters and then cover issues in signaling and signal integrity. Chapters through cover detailed concepts in basic passive circuit components, with particular emphasis on multiconductor interconnects. One of the more difficult aspects of detailed simulations in signal integrity is the need to model multiconductor interconnects such as sockets, packages, edge connectors, and buses. Experimental characterization of interconnects is covered in chapter, where emphasis is on measurements of very small parasitics for high leadcount interconnects. Interconnect modeling is covered in chapters and, where distinction is drawn between low-frequency lumped modeling and high-frequency wideband modeling. Because interconnects are often physically small, lumped modeling is often the optimal choice. Finally, chapter provides extended coverage of signal integrity topics and represents advanced application of material and concepts from prior chapters. The manuscript was typeset using running under Linux on a PC clone based on a Tyan motherboard with a Cyrix processor. The text was prepared using a custom text editor written in Tcl/Tk. Circuit simulations used Berkeley SPICE 3f4. The figures were prepared using Xfig. Symbolic manipulation usedMathematica. Brian Young Austin, Texas

Signal Integrity

Author: Eric Bogatin
Publisher: Prentice Hall Professional
ISBN: 9780130669469
Format: PDF
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This thorough review of the fundamental principles associated with signal integrity provides engineering principles behind signal integrity effects, and applies this understanding to solving problems.

Signal Integrity and Radiated Emission of High Speed Digital Systems

Author: Spartaco Caniggia
Publisher: John Wiley & Sons
ISBN: 0470772883
Format: PDF, Docs
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Before putting digital systems for information technology or telecommunication applications on the market, an essential requirement is to perform tests in order to comply with the limits of radiated emission imposed by the standards. This book provides an investigation into signal integrity (SI) and electromagnetic interference (EMI) problems. Topics such as reflections, crosstalk, switching noise and radiated emission (RE) in high-speed digital systems are covered, which are essential for IT and telecoms applications. The highly important topic of modelling is covered which can reduce costs by enabling simulation data to demonstrate that a product meets design specifications and regulatory limits. According to the new European EMC directive, this can help to avoid the expensive use of large semi-anechoic chambers or open area test sites for radiated emission assessments. Following a short introduction to signalling and radiated interference in digital systems, the book provides a detailed characterization of logic families in terms of static and dynamic characteristic useful for modelling techniques. Crosstalk in multi-coupled line structures are investigated by analytical, graphical and circuit-based methods, and techniques to mitigate these phenomena are provided. Grounding, filtering and shielding with multilayer PCBs are also examined and design rules given. Written by authors with extensive experience in industry and academia. Explains basic conceptual problems from a theoretical and practical point of view by using numerous measurements and simulations. Presents models for mathematical and SPICE-like circuit simulators. Provides examples of using full-wave codes for SI and RE investigations. Companion website containing lists of codes and sample material. Signal Integrity and Radiated Emission of High-Speed Digital Systems is a valuable resource to industrial designers of information technology, telecommunication equipment and automation equipment as well as to development engineers. It will also be of interest to managers and designers of consumer electronics, and researchers in electronics.

Signal Integrity Characterization Techniques

Author: Mike Resso
Publisher: Intl. Engineering Consortiu
ISBN: 9781931695930
Format: PDF, ePub, Mobi
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Cogently addressing the future of signal integrity and the effect it will have on the data-transmission industry as a whole, this all-inclusive guide addresses a wide array of technologies, from traditional, digital data transmission to microwave measurements, and accessibly examines the gap between the two. Focusing on real-world applications and providing a wide array of case studies that show how each technology can be used—from backplane design challenges to advanced error correction techniques—this guide addresses many of today’s high-speed technologies while also providing excellent insight into their future direction. With numerous valuable lessons pertaining to the signal integrity industry, this resource is the ultimate must-read guide for any specialist in the design engineering field.

Understanding Signal Integrity

Author: Stephen C. Thierauf
Publisher: Artech House
ISBN: 1596939826
Format: PDF, ePub
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This unique book provides you with practical guidance on understanding and interpreting signal integrity (SI) performance to help you with your challenging circuit board design projects. You find high-level discussions of important SI concepts presented in a clear and easily accessible format, including question and answer sections and bulleted lists.This valuable resource features rules of thumb and simple equations to help you make estimates of critical signal integrity parameters without using circuit simulators of CAD (computer-aided design). The book is supported with over 120 illustrations, nearly 100 equations, and detailed reference lists at the end of each chapter.

Transmission Lines in Digital Systems for EMC Practitioners

Author: Clayton R. Paul
Publisher: John Wiley & Sons
ISBN: 1118145569
Format: PDF, ePub, Mobi
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This is a brief but comprehensive book covering the set of EMC skills that EMC practitioners today require in order to be successful in high-speed, digital electronics. The basic skills in the book are new and weren’t studied in most curricula some ten years ago. The rapidly changing digital technology has created this demand for a discussion of new analysis skills particularly for the analysis of transmission lines where the conductors that interconnect the electronic modules have become “electrically large,” longer than a tenth of a wavelength, which are increasingly becoming important. Crosstalk between the lines is also rapidly becoming a significant problem in getting modern electronic systems to work satisfactorily. Hence this text concentrates on the modeling of “electrically large” connection conductors where previously-used Kirchhoff’s voltage and current laws and lumped-circuit modeling have become obsolete because of the increasing speeds of modern digital systems. This has caused an increased emphasis on Signal Integrity. Until as recently as some ten years ago, digital system clock speeds and data rates were in the hundreds of megahertz (MHz) range. Prior to that time, the “lands” on printed circuit boards (PCBs) that interconnect the electronic modules had little or no impact on the proper functioning of those electronic circuits. Today, the clock and data speeds have moved into the low gigahertz (GHz) range.

Signal and Power Integrity simplified

Author: Eric Bogatin
Publisher: Pearson Education
ISBN: 0132349795
Format: PDF, ePub, Docs
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The #1 guide to signal integrity, updated with all-new coverage of power integrity, high-speed serial links, and more * * Up-to-the-minute comprehensive guidance: everything engineers need to know to understand and design for signal integrity. * Authored by world-renowned signal integrity trainer, educator, and columnist Eric Bogatin. * Focuses on intuitive understanding, practical tools, and engineering discipline - not theoretical derivation or mathematical rigor. Today's marketplace demands faster devices and systems that deliver more functionality and longer life in smaller packaging. Signal Integrity - Simplified, Second Edition is the first book to bring together all the up-to-the-minute techniques designers need to overcome all of those challenges. Renowned expert Eric Bogatin thoroughly reviews the root causes of all four families of signal integrity problems, and shows how to design them out early in the design cycle. Drawing on his experience teaching 5,000+ engineers, he illuminates signal integrity, physical design, bandwidth, inductance, and impedance; presents practical tools for solving signal integrity problems; and offers specific design guidelines and solutions. In this edition, Bogatin adds extensive coverage of power integrity and high speed serial links: topics at the forefront of signal integrity design. Three new chapters address: * * Designing power delivery networks to support high-speed signal processing. * Using 4-Port S-parameters, the emerging standard for describing interconnects in high speed serial links. * Working with today's measurement and simulation tools and technologies

High speed Digital Design

Author: Howard W. Johnson
Publisher:
ISBN: 9780133957242
Format: PDF, ePub
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Focused on the field of knowledge lying between digital and analog circuit theory, this new text will help engineers working with digital systems shorten their product development cycles and help fix their latest design problems. The scope of the material covered includes signal reflection, crosstalk, and noise problems which occur in high speed digital machines (above 10 megahertz). This volume will be of practical use to digital logic designers, staff and senior communications scientists, and all those interested in digital design.

Transmission Lines in Digital Systems for EMC Practitioners

Author: Clayton R. Paul
Publisher: John Wiley & Sons
ISBN: 1118145569
Format: PDF
Download Now
This is a brief but comprehensive book covering the set of EMC skills that EMC practitioners today require in order to be successful in high-speed, digital electronics. The basic skills in the book are new and weren’t studied in most curricula some ten years ago. The rapidly changing digital technology has created this demand for a discussion of new analysis skills particularly for the analysis of transmission lines where the conductors that interconnect the electronic modules have become “electrically large,” longer than a tenth of a wavelength, which are increasingly becoming important. Crosstalk between the lines is also rapidly becoming a significant problem in getting modern electronic systems to work satisfactorily. Hence this text concentrates on the modeling of “electrically large” connection conductors where previously-used Kirchhoff’s voltage and current laws and lumped-circuit modeling have become obsolete because of the increasing speeds of modern digital systems. This has caused an increased emphasis on Signal Integrity. Until as recently as some ten years ago, digital system clock speeds and data rates were in the hundreds of megahertz (MHz) range. Prior to that time, the “lands” on printed circuit boards (PCBs) that interconnect the electronic modules had little or no impact on the proper functioning of those electronic circuits. Today, the clock and data speeds have moved into the low gigahertz (GHz) range.